Korean Talks
Image default
Finanace

[PHOTO] Next-generation memory architecture

Visitors take photos of mockups of zHBM and zNAND-O, 3D architecture for advanced DRAM and NAND memory chips, at Samsung Electronics’ booth for the SEDEX 2026 semiconductor exhibition at Coex in southern Seoul, Wednesday. Along with Samsung Electronics, SK hynix and 300 other companies in the semiconductor supply chain are participating in the exhibition, which runs through Friday. Yonhap

Related posts

Lee returns home from trip to Singapore, Philippines amid Middle East tensions

Claire R. Peck

Police raid Nat’l Assembly Secretariat in conflict-of-interest probe involving committee chief

Claire R. Peck

Israel to receive more US refuelling planes as Iran attacks intensify, Israeli officials say

Claire R. Peck